This movement is needed because the hwmon entries and corresponding sysfs
interface is a duplicate of utilities already provided by
driver/thermal/thermal_sys.c. The goal is to place it in thermal folder
and add necessary functions to use the in-kernel thermal interfaces.
Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org>
Acked-by: Guenter Roeck <guenter.roeck@ericsson.com>
Cc: SangWook Ju <sw.ju@samsung.com>
Cc: Durgadoss <durgadoss.r@intel.com>
Cc: Len Brown <lenb@kernel.org>
Cc: Jean Delvare <khali@linux-fr.org>
Cc: Kyungmin Park <kmpark@infradead.org>
Cc: Kukjin Kim <kgene.kim@samsung.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
This patch allows to read temperature
from TMU(Thermal Management Unit) of SAMSUNG EXYNOS4 series of SoC.
Signed-off-by: Donggeun Kim <dg77.kim@samsung.com>
Signed-off-by: MyungJoo Ham <myungjoo.ham@samsung.com>
Signed-off-by: Kyungmin Park <kyungmin.park@samsung.com>
Signed-off-by: Guenter Roeck <guenter.roeck@ericsson.com>
