This movement is needed because the hwmon entries and corresponding sysfs interface is a duplicate of utilities already provided by driver/thermal/thermal_sys.c. The goal is to place it in thermal folder and add necessary functions to use the in-kernel thermal interfaces. Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org> Acked-by: Guenter Roeck <guenter.roeck@ericsson.com> Cc: SangWook Ju <sw.ju@samsung.com> Cc: Durgadoss <durgadoss.r@intel.com> Cc: Len Brown <lenb@kernel.org> Cc: Jean Delvare <khali@linux-fr.org> Cc: Kyungmin Park <kmpark@infradead.org> Cc: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com> |
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.. | ||
ad7266.h | ||
at91_adc.h | ||
atmel-aes.h | ||
atmel.h | ||
clk-integrator.h | ||
clk-nomadik.h | ||
clk-u300.h | ||
cpsw.h | ||
dwc3-exynos.h | ||
dwc3-omap.h | ||
efm32-uart.h | ||
ehci-sh.h | ||
emif_plat.h | ||
exynos_thermal.h | ||
fsa9480.h | ||
gpio-em.h | ||
i2c-nomadik.h | ||
ina2xx.h | ||
leds-lm3556.h | ||
leds-renesas-tpu.h | ||
lp855x.h | ||
lp8727.h | ||
macb.h | ||
mmp_audio.h | ||
msm_serial_hs.h | ||
mv_usb.h | ||
ntc_thermistor.h | ||
omap-abe-twl6040.h | ||
omap4-keypad.h | ||
omap_drm.h | ||
pxa_sdhci.h | ||
s3c-hsotg.h | ||
s3c-hsudc.h | ||
tegra_emc.h | ||
tegra_usb.h | ||
uio_pruss.h | ||
wiznet.h |